Intercooler Pump Locations?

[v6tungsten]

Right now this is the best and least expensive option. And it makes a big difference. Those 13' HE's will be getting scarce at some point though. I had a bunch at one point. I'm all sold out now.

Yep, and they are getting more expensive on Ebay..listing for $399 now

 

[hamish]

Im sure DOB HE will be better but as it not available I purchased the 2013 HE ($225) and pump ($250) for my car. I'll have a bigger HE and better pump than 99% of people for $475.

Following to see if you think opening the saleen IC to 1" is worth the cost...

Well this work did not cost much to be honest.
But it is not the prefered final option.

DOB has done it the way I would have prefered, Oring grooves providing the seal on the inner case, straight thread.

I am relying on the NPT thread to seal instead of an oring like the oem one in my comparison picture.

But I am willing to give it a shot.

The fitting I am using is very similar to the oem, as it has an oring groove on the back side of the hex nut.

I am using a 3.2" pulley with a 10%od balancer and It works for now, but the heat does get up if I am in the gas for more than 10 sec.

It's reading AITs in the 130's when I let off and ofcourse it climbs for a few seconds after, then recovers.

I am thinking the GT500 OEM gear may provide some more room with this 3.2" pulley.

But I am certain I will need the machined IC and DOB HE and EMP pump to have a shot at running the 2.75" pulley safely for my intended uses of this car.

And that may not be enough, Taxing the saleen immensly with these blower speeds.

 

[Pentalab]

The story I got was the 13/14 GT-500 HE is 25" wide x 11" high x 3.125" deep. ( 859 cubic inches). That's just the actual core area. Then toss in an inch on each side for the tanks.

Dunno how big the DOB monster will be, but in an ideal world, the ultimate HE would have a core area of 25" wide x 18" tall x 3.125" thick. (1406 cubic inchs)

To really do this right, the HE should be tall enough, so it gets hit with air from both upper + lower grille openings. It's bad enough that the bumper blocks a huge chunk of the HE, but most of these HE's are plane not tall enough. They only get air from the lower grille opening. Airflow is everything on any rad.

If they had just made the 13/14 GT-500 HE... 7" taller, they would have nailed it. That, and bigger inlets and outlets. The HE's equipped with fans, only move the air through at aprx 16 mph. IMO, I'd dump the fan(s)..and increase the core depth any day.

 

[hamish]

So any specific mounting requirements for the GT500 pump?
Do's, Don'ts?

 

[v6tungsten]

Well this work did not cost much to be honest.
But it is not the prefered final option.

DOB has done it the way I would have prefered, Oring grooves providing the seal on the inner case, straight thread.

I am relying on the NPT thread to seal instead of an oring like the oem one in my comparison picture.

But I am willing to give it a shot.

The fitting I am using is very similar to the oem, as it has an oring groove on the back side of the hex nut.

NPT thread will be fine. Correct me if I'm wrong but the DoB GT450 uses NPT on its IC. I know its not Oringed on the gt450 kit, I haven't seen any problem with those leaking.

 

[v6tungsten]

yea dont know if I will ever get there but looking to make 600-700rwhp. Just need the engine to blow to get there. As this is my second car and dont drive it much. secondly dont want to spend 10k on a forged motor and new DOB supercharger kit if my saleen supercharged engine is still running fine @480rwhp.

 

[hamish]

NPT thread will be fine. Correct me if I'm wrong but the DoB GT450 uses NPT on its IC. I know its not Oringed on the gt450 kit, I haven't seen any problem with those leaking.

I was making an assumption, I'm sure he will clear it up.
Either way it always appears to be top shelf work when he brings something out to market.
Hence why I am willing to wait for his Cooling system gear to come out.
Still mounting that EMP pump is going to be a bitch to get it into best practices.

 

[Department Of Boost]

NPT thread will be fine. Correct me if I'm wrong but the DoB GT450 uses NPT on its IC. I know its not Oringed on the gt450 kit, I haven't seen any problem with those leaking.

Correct, our stuff is NPT for the water fittings. A NPT fitting is good up to about a billion psi so that's all good. No chance of a water leak.

The o ring seals the IC to the body of the manifold. This prevents boost from leaking out.

We are going to switch everything over the AN O ring fittings here soon. The IC won't have any threads in it at all. The IC will seal to the body with an O ring. It will be the water/air barrier. The fittings will screw right into the body of the manifold. There are a lot more AN O ring fittings available and they cost less money. It also allows us to use a smaller IC tank/spigot so we can have more room for the bypass valve. We came up with this configuration for the GT500 manifold (coming soon). It isn't as thick as out other stuff and we couldn't run 1.25" fittings in the "old" way.

 

[Department Of Boost]

I was making an assumption, I'm sure he will clear it up.
Either way it always appears to be top shelf work when he brings something out to market.
Hence why I am willing to wait for his Cooling system gear to come out.
Still mounting that EMP pump is going to be a bitch to get it into best practices.

All of the cooling system stuff will be AN o ring. Meziere has fittings that go from -20AN O ring (1.25') to pretty much anything on the other side. .5-1.25" AN or nipple. This way the stuff can be used in any configuration with a simple fitting change.

 

[v6tungsten]

Correct, our stuff is NPT for the water fittings. A NPT fitting is good up to about a billion psi so that's all good. No chance of a water leak.

The o ring seals the IC to the body of the manifold. This prevents boost from leaking out.

We are going to switch everything over the AN O ring fittings here soon. The IC won't have any threads in it at all. The IC will seal to the body with an O ring. It will be the water/air barrier. The fittings will screw right into the body of the manifold. There are a lot more AN O ring fittings available and they cost less money. It also allows us to use a smaller IC tank/spigot so we can have more room for the bypass valve. We came up with this configuration for the GT500 manifold (coming soon). It isn't as thick as out other stuff and we couldn't run 1.25" fittings in the "old" way.

So the Saleen IC Hamish resized will be fine as it still has the Oring on the outside of the case to stop any boost from leaking? The OEM saleen had oring on both sides but one was because IC had straight threads and needed to seal to prevent water leak, second was to prevent case leaking... http://www.s197forum.com/forum/member.php?u=3052

 

[Department Of Boost]

So the Saleen IC Hamish resized will be fine as it still has the Oring on the outside of the case to stop any boost from leaking? The OEM saleen had oring on both sides but one was because IC had straight threads and needed to seal to prevent water leak, second was to prevent case leaking... http://www.s197forum.com/forum/member.php?u=3052

I can't tell exactly from the pic, and I don't remember what he sent me for a drawing but if I remember correctly the IC will seal to the case with an o ring. That's an boost/water seal. Then the fitting that goes in the case is a AN o ring so that seals water at the case. That works.

 

[hamish]

I am actually going to use black rtv on the IC face to aid in preventing boost leakage through the case. Npt will seal the water side. The oring on the fitting should theoretically seal the boost from escaping through, but I think the rtv will need to be there for extra protect.

 

[hamish]

There just wasn't enough room to open up the IC to 1.25" without more fab\machining.
The external groove you see in the image of the expanded IC would not contain an oring as it would spill over the top and under the IC face.
The ring internal to that machined groove is actually a raised face that mates to the inner case. We removed the secondary raised ring while expanding the IC opening. Both rings effectively created the o ring enclosure as it was meant to be OEM. the rings are raised close to 1/4".
The inner case was OEM machined to create a sealable surface, but it is limited in it's width, I could not get that machined with the machinery around here.

So the plan is NPT will seal the water in the IC
A layer of RTV will be globbed on the IC's outer face, sealing against pressure leaking through the pressure side, and preventing any water leakage into the case itself.
Essentially I am making one ugly oring\gasket.between the IC face and Machined surface of the case.

There is still a oring on the fitting aswell.
But it is a not a store bought item, I had a machinist turn something I had into a fitting you see in the other image from earlier.

Plus I asssumed DOB used straight thread, but now that I know he has been using NPT I have gained more confidence in this experiment.

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[Department Of Boost]

I am actually going to use black rtv on the IC face to aid in preventing boost leakage through the case. Npt will seal the water side. The oring on the fitting should theoretically seal the boost from escaping through, but I think the rtv will need to be there for extra protect.

I glaze the O ring between the case (I call it a body, same difference) and the IC with RTV when I'm assembling them. The O ring should be more than fine, but it's cheap insurance.

I've never had an AN O ring fitting leak.

 

[hamish]

So quick question, would you use the black RTV on the inner case in my application, or use a second option of using a high quality gasket material covering the full face of th IC, I can do either or.
I see the RTV as being the most adaptable in terms of different surface textures, but I may never get that IC out of the case again without destrying it.

Appossed to a retangular gasket that would allow for easy removal as it won't be bonded to the surfaces.

Any opinion on these two?

 

[v6tungsten]

my opinion is you really don't need either. The npt is good sealing for protecting against water leak, Oring will seal against boost leakage.

if you use anything go lightly with the sealant in the machined area of the oem IC and case. He's already said he's never had an oring leak before.

 

[Department Of Boost]

So quick question, would you use the black RTV on the inner case in my application, or use a second option of using a high quality gasket material covering the full face of th IC, I can do either or.
I see the RTV as being the most adaptable in terms of different surface textures, but I may never get that IC out of the case again without destrying it.

Appossed to a retangular gasket that would allow for easy removal as it won't be bonded to the surfaces.

Any opinion on these two?

my opinion is you really don't need either. The npt is good sealing for protecting against water leak, Oring will seal against boost leakage.

if you use anything go lightly with the sealant in the machined area of the oem IC and case. He's already said he's never had an oring leak before.

I agree you don't need to RTV. But it's cheap insurance. A skim coat of black and you're GTG.

 

[hamish]

I have decided to wait until DOB gets his Big Ass HE on the market and after I complete a wiring tuck\relocation this winter before I install the EMP pump and go with the bigger hose\fitting size..

So I have decided to mount the 2013 GT500 heat exchanger and keep the 3\4" fittings and hoses setup and see if there are any noticeable AIT gains this summer.

My question is this-
What is the proper mounting configuration for the 2013 GT500 Intercooler pump?

I see VMP mounts it horizontally.

OEM is kind of skewed between the horizontal and vertical plain.

I can mount it vertically easily enough but should it be in a horizontal config?

 

[Department Of Boost]

I have decided to wait until DOB gets his Big Ass HE on the market and after I complete a wiring tuck\relocation this winter before I install the EMP pump and go with the bigger hose\fitting size..

So I have decided to mount the 2013 GT500 heat exchanger and keep the 3\4" fittings and hoses setup and see if there are any noticeable AIT gains this summer.

My question is this-
What is the proper mounting configuration for the 2013 GT500 Intercooler pump?

I see VMP mounts it horizontally.

OEM is kind of skewed between the horizontal and vertical plain.

I can mount it vertically easily enough but should it be in a horizontal config?

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